Low-temperature adhesion and the application on conductive...

Microelectronic Engineering 2020 / 04 Vol. 226

Low-temperature adhesion and the application on conductive treatment of curved-surface piezoelectric composite material

Liao, Qingwei, Kang, Binglin, Lei, Ou, Chen, Liyin, Qin, Lei, Wang, Likun
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Volume:
226
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2020.111291
Date:
April, 2020
File:
PDF, 2.12 MB
2020
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