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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Simulation of Wire Bond Clamping and Its effect on Die Pad Tilt
Tan, Lay Tatt, Tan, Wee Kien, Wai, Chee MunYear:
2019
DOI:
10.1109/EPTC47984.2019.9026627
File:
PDF, 10.19 MB
2019