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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Investigation of Processing Parameters for the Fabrication of Microfluidic Connectors Using a UV-assisted Coaxial 3D Printing System
Xu, Qianwen, Lo, Jeffery Chi Chuen, Lee, Shi-Wei RickyYear:
2019
DOI:
10.1109/EPTC47984.2019.9026686
File:
PDF, 3.14 MB
2019