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[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - High Q-factor 3D Solenoid Inductor on InFO Package for RF System Integration
Tang, Tzu-Chun, Lin, Chia-Chia, Hsu, Che-Wei, Lu, Chun-Lin, Tsai, Chung-Hao, Wu, Kai-Chiang, Pu, Han-Ping, Liu, Chung-Shi, Wang, Chuei-Tang, Yu, DougYear:
2019
DOI:
10.1109/edaps47854.2019.9011648
File:
PDF, 2.04 MB
2019