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[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Achieving Beamforming using a Dual-fed Patch Antenna Array with FSS Transmit-array for 5G Base-station Applications
Yang, Chi-Hau, Hsu, Chung-Yi, Chung, Hung-Wei, Hwang, Lih-TyngYear:
2019
DOI:
10.1109/edaps47854.2019.9011651
File:
PDF, 739 KB
2019