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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Thin film adhesion measurement by nanoindentation: Review of methodologies and validation by means of finite element simulations
Albrecht, Jan, Weissbach, Marie, Auersperg, Juergen, Dudek, Rainer, Kaulfersch, Eberhard, Rzepka, SvenYear:
2019
DOI:
10.1109/eptc47984.2019.9026575
File:
PDF, 1.20 MB
2019