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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Epoxy Mold Compound Curing Behavior and Mold Process Cure Time Interaction on Molded Package Performance
Garete, April Joy H., Fadullo, Marlon F., Roscain, Reinald John S.Year:
2019
DOI:
10.1109/eptc47984.2019.9026644
File:
PDF, 2.17 MB
2019