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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Mechanical property of new concept about Cu core bump formation For high reliability PKG

Son, J.Y., Jeong, Haksan, Lee, S.G., Lee, Y.W., Jung, S.B.
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Year:
2019
DOI:
10.1109/eptc47984.2019.9026666
File:
PDF, 2.87 MB
2019
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