[IEEE 2019 14th International Microsystems, Packaging,...

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[IEEE 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2019.10.23-2019.10.25)] 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - LTD PKG. (Liquid Thermal Dissipation Package) Technology

Huang, Yu Lung, Chung, C. Key, Lin, C.F., Xu, Bruce, Liao, Yunn Shiuan
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Year:
2019
DOI:
10.1109/impact47228.2019.9024979
File:
PDF, 720 KB
2019
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