Effect of the Curing Properties and Viscosities of...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2020

Effect of the Curing Properties and Viscosities of Non-Conductive Films (NCFs) on the Solder Joint Morphology and Reliability of Chip On Board (COB) Packages using Cu-pillar/Sn-Ag Bumps

Lee, Hanmin, Lee, Seyong, Choi, Taejin, Park, Sooin, Ko, Eun Kyoung, Paik, Kyung-Wook
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Year:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2020.2980598
File:
PDF, 529 KB
2020
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