Signal Integrity Design and Analysis of 3D X-Point Memory...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2020

Signal Integrity Design and Analysis of 3D X-Point Memory Considering Crosstalk and IR Drop for Higher Performance Computing

Son, Kyungjune, Cho, Kyungjun, Kim, Subin, Park, Shinyoung, Jung, Daniel H., Park, Junyong, Park, Gapyeol, Kim, Seongguk, Shin, Taein, Kim, Youngwoo, Kim, Joungho
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Year:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2020.2984268
File:
PDF, 1.31 MB
2020
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