![](/img/cover-not-exists.png)
[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Characterization of Tin Pest Phenomenon in a Low Ag Content SAC Solder Alloy
Illes, Balazs, Skwarek, Agata, Hurtony, Tamas, Krammer, Oliver, Harsanyi, Gabor, Witek, KrzysztofYear:
2019
DOI:
10.23919/EMPC44848.2019.8951853
File:
PDF, 4.43 MB
2019