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[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror
Noriki, Akihiro, Tamai, Isao, Ibusuki, Yasuhiro, Ukita, Akio, Suda, Satoshi, Shimura, Daisuke, Onawa, Yosuke, Yaegashi, Hiroki, Amano, TakeruYear:
2019
DOI:
10.1109/3DIC48104.2019.9058779
File:
PDF, 2.27 MB
2019