![](/img/cover-not-exists.png)
[IEEE 2018 International Conference on Information and Telecommunication Technologies and Radio Electronics (UkrMiCo) - Odessa, Ukraine (2018.9.10-2018.9.14)] 2018 International Conference on Information and Telecommunication Technologies and Radio Electronics (UkrMiCo) - Stress Estimation for Encapsulated Electronic Packages Subjected to Thermal Impacts
Kovtun, Igor, Petrashchuk, Svitlana, Boiko, JuliyYear:
2018
DOI:
10.1109/ukrmico43733.2018.9047514
File:
PDF, 268 KB
2018