[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Investigation on Thermal Contact Resistance Between Indium and Cap in Packaging
Hu, Jianxiong, Fengchen, Zefang, Zhang, Ye, Xu, Yixin, Zhu, FulongYear:
2019
DOI:
10.1109/eptc47984.2019.9026694
File:
PDF, 1.69 MB
2019