The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
1996 Vol. 11; Iss. 7
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Complex Effects of Additives of Cl- and Glue on Surface Morphology of Copper Foil for Printed Wiring Boards Electrodeposited at High Speed.
OSAKA, Tetsuya, SAKAKIBARA, Akira, TAMURA, Keiu, HOMMA, Takayuki, OKINAKA, YutakaVolume:
11
Year:
1996
Journal:
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
DOI:
10.5104/jiep1995.11.494
File:
PDF, 11.11 MB
1996