Nanoscale‐Dewetting‐Based Direct Interconnection of...

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Advanced Materials 2020 / 04

Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing

Lee, Ju Seung, Kang, Seung Ji, Shin, Joo Hwan, Shin, Yiel Jae, Lee, Byunghoon, Koo, Ja‐Myeong, Kim, Tae‐il
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Journal:
Advanced Materials
DOI:
10.1002/adma.201908422
Date:
April, 2020
File:
PDF, 2.32 MB
2020
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