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3D Microelectronics: 3D SelfâAssembled Microelectronic Devices: Concepts, Materials, Applications (Adv. Mater. 15/2020)
Karnaushenko, Daniil, Kang, Tong, Bandari, Vineeth K., Zhu, Feng, Schmidt, Oliver G.Volume:
32
Journal:
Advanced Materials
DOI:
10.1002/adma.202070120
Date:
April, 2020
File:
PDF, 25.85 MB
2020