Improvement of strength-ductility trade-off in a...

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Journal of Materials Science: Materials in Electronics 2020 / 4

Improvement of strength-ductility trade-off in a Sn–0.7Cu–0.2Ni lead-free solder alloys through Al-microalloying

El-Daly, A., Eladly, S. A., Mohamed, Amal, Elmosalami, T. A., Dawood, Mahmoud S.
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Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-020-03400-z
Date:
April, 2020
File:
PDF, 3.32 MB
2020
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