A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging
Vallepuga-Espinosa, J., Ubero-MartÃnez, I., RodrÃguez-Tembleque, L., Cifuentes-RodrÃguez, J.Volume:
115
Journal:
Engineering Analysis with Boundary Elements
DOI:
10.1016/j.enganabound.2020.02.011
Date:
June, 2020
File:
PDF, 4.00 MB
2020