Direct bonding of aluminum to alumina using a nickel...

Results in Materials 2020 / 06 Vol. 6

Direct bonding of aluminum to alumina using a nickel interlayer for power electronics applications

Wang, Yu-Ting, Cheng, Yun-Hsiang, Lin, Chien-Cheng, Lin, Kun-Lin
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Volume:
6
Journal:
Results in Materials
DOI:
10.1016/j.rinma.2020.100093
Date:
June, 2020
File:
PDF, 2.76 MB
2020
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