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Study on the Spreading Characteristics of the Solder Sn-3.0Ag-0.5Cu on an Inverted V-shaped Substrate
Yang, Xiaolin, Xu, Bingsheng, Hou, Shan, Liu, Ren, Zhao, Xuezhi, Coenye, T., Huang, H.Volume:
145
Year:
2020
Journal:
E3S Web of Conferences
DOI:
10.1051/e3sconf/202014502069
File:
PDF, 1.67 MB
2020