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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Highly Customizable RDL Combined with UBM for Various Solder Applications in Wafer Level Packaging
Yeoh, Kim Hoey, Salazar, Christopher, Thalmann, Robert, Bieck, Florian, Teutsch, ThorstenYear:
2019
DOI:
10.1109/eptc47984.2019.9026688
File:
PDF, 2.04 MB
2019