Influence of Hydrophobic Fin Configuration in Thermal...

Energies 2020 / 04 Vol. 13; Iss. 7

Influence of Hydrophobic Fin Configuration in Thermal System in Relation to Electronic Device Cooling Applications

Shuja, Shahzada Zaman, Yilbas, Bekir Sami, Al-Qahtani, Hussain
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Volume:
13
Journal:
Energies
DOI:
10.3390/en13071631
Date:
April, 2020
File:
PDF, 3.85 MB
2020
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