Effect of Thermal Boundary Resistance between the Interconnect Metal and Dielectric Interlayer on Temperature Increase of Interconnects in Deeply Scaled VLSI
Zhan, Tianzhuo, Oda, Kaito, Ma, Shuaizhe, Tomita, Motohiro, Jin, Zhicheng, Takezawa, Hiroki, Mesaki, Kohei, Wu, Yen-Ju, Xu, Yibin, Matsukawa, Takashi, Matsuki, Takeo, Watanabe, TakanobuJournal:
ACS Applied Materials & Interfaces
DOI:
10.1021/acsami.0c03010
Date:
April, 2020
File:
PDF, 2.80 MB
2020
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