Modeling of grinding chip thickness distribution based on...

Journal of Advanced Mechanical Design Systems and Manufacturing 2020 Vol. 14; Iss. 1

Modeling of grinding chip thickness distribution based on material removel mode in grinding of SiC ceramics

WU, Chongjun, DONG, Wanjiao, ZHU, Lijian, ZHANG, Jian, XU, Lijun, LIANG, Steven Y
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Volume:
14
Year:
2020
Journal:
Journal of Advanced Mechanical Design, Systems, and Manufacturing
DOI:
10.1299/jamdsm.2020jamdsm0018
File:
PDF, 1.71 MB
2020
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