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Journal of Electronic Testing 2020 / 4

Co-Optimization of Test Wrapper Length and TSV for TSV Based 3D SOCs

Kaibartta, Tanusree, Biswas, G. P., Das, Debesh Kumar
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Journal:
Journal of Electronic Testing
DOI:
10.1007/s10836-020-05872-7
Date:
April, 2020
File:
PDF, 1.23 MB
2020
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