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Mechanism of indium tin oxide//indium tin oxide direct wafer bonding
Hönle, Michael, Oberhumer, Peter, Hingerl, Kurt, Wagner, Thorsten, Huppmann, Sophia, Katz, SimeonVolume:
704
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2020.137964
Date:
June, 2020
File:
PDF, 2.83 MB
2020