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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Failure Mechanism Study for Low-k Device Bond Pad Crack Post Temperature Cycle
Liu, Haiyan, Pang, Xingshou, Xu, SeanYear:
2019
DOI:
10.1109/eptc47984.2019.9026597
File:
PDF, 1.63 MB
2019