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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Thermal Evaluation of TSVs in 3D-Integration Technology

Harb, Shadi M.S., Eisenstadt, William
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Year:
2019
DOI:
10.1109/EPTC47984.2019.9076748
File:
PDF, 309 KB
2019
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