[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Laser Frit Sealing Approach for Ultrathin Glass
Bedjaoui, M., Brun, J., Amiran, J.Year:
2019
DOI:
10.23919/EMPC44848.2019.8951837
File:
PDF, 1.08 MB
2019