Significantly improving the etching characteristics of...

Surface and Coatings Technology 2020 / 03 Vol. 386

Significantly improving the etching characteristics of electroplated Cu films through microstructure modification

Lee, Cheng-Yu, Lin, Ping-Chou, Yang, Cheng-Hsien, Ho, Cheng-En
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Volume:
386
Journal:
Surface and Coatings Technology
DOI:
10.1016/j.surfcoat.2020.125471
Date:
March, 2020
File:
PDF, 5.19 MB
2020
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