[IEEE 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Richland, WA, USA (2019.10.20-2019.10.23)] 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Enhanced Thermal Conductive Boron Nitride/ Silicon Carbide/ Silicone Elastomer with Nonlinear Conductive Characteristic and Partial Discharge Resistance

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