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[IEEE 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Richland, WA, USA (2019.10.20-2019.10.23)] 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Enhanced Thermal Conductive Boron Nitride/ Silicon Carbide/ Silicone Elastomer with Nonlinear Conductive Characteristic and Partial Discharge Resistance
Wang, Yalin, Wu, Jiandong, Han, Tao, Yin, and YiYear:
2019
DOI:
10.1109/CEIDP47102.2019.9009730
File:
PDF, 2.75 MB
2019