New challenges of miniaturization of electronic devices:...

Materials & Design 2020 / 07 Vol. 192

New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints

Zhang, Peng, Xue, Songbai, Wang, Jianhao
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Volume:
192
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2020.108726
Date:
July, 2020
File:
PDF, 2.36 MB
2020
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