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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Ultrathin Die Pick-Up for 3D Chip Stacking
Kawano, Masaya, Hirota, Naoya, Lim, Sharon Pei-Siang, Chong, Ser-ChoongYear:
2019
DOI:
10.1109/eptc47984.2019.9026703
File:
PDF, 485 KB
2019