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[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections
Miura, Tsukasa, Sakakibara, Masaki, Takahashi, Hirotsugu, Taura, Tadayuki, Tatani, Keiji, Oike, Yusuke, Ezaki, TakayukiYear:
2019
DOI:
10.1109/3DIC48104.2019.9058832
File:
PDF, 559 KB
2019