[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Stress and Strain Level Evolution and Correlation to Void Migration in Solder Bumps after Various Thermo-mechanical Post Treatments
Newman, Keith, Lee, Tae-Kyu, Tan, Gek Joo, Lim, Siew KimYear:
2019
DOI:
10.1109/eptc47984.2019.9026608
File:
PDF, 4.03 MB
2019