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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - An approach for failure prediction in H 3 TRB-tests
Kolbinger, Elisabeth, Wuest, Felix, Dijk, Marius van, Trampert, Stefan, Lang, Klaus-DieterYear:
2019
DOI:
10.23919/EMPC44848.2019.8951836
File:
PDF, 1.06 MB
2019