Application of Fluid Simulation in High-Speed Copper...

Application of Fluid Simulation in High-Speed Copper Sulfate Plating Using a Jet Flow Device; 噴流式めっき装置を用いた高速硫酸銅めっきにおける流体シミュレーションの活用;

SUZUKI, Yohei, UMEDA, Yasushi, AKUTSU, Toshinosuke, Cordonier, Christpher E. J., HONMA, Hideo, TAKAI, Osamu, Noh, Joo-Hyong
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Volume:
70
Journal:
Journal of The Surface Finishing Society of Japan
DOI:
10.4139/sfj.70.566
Date:
November, 2019
File:
PDF, 4.48 MB
2019
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