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Application of Fluid Simulation in High-Speed Copper Sulfate Plating Using a Jet Flow Device; å´æµå¼ãã£ãè£ ç½®ãç¨ããé«éç¡«é ¸é ãã£ãã«ãããæµä½ã·ãã¥ã¬ã¼ã·ã§ã³ã®æ´»ç¨;
SUZUKI, Yohei, UMEDA, Yasushi, AKUTSU, Toshinosuke, Cordonier, Christpher E. J., HONMA, Hideo, TAKAI, Osamu, Noh, Joo-HyongVolume:
70
Journal:
Journal of The Surface Finishing Society of Japan
DOI:
10.4139/sfj.70.566
Date:
November, 2019
File:
PDF, 4.48 MB
2019