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[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Effects of Cracks on Interfacial Thermal Properties of LED Packages by Entropy Generation
Cui, Peng, Cai, Miao, Yang, Daoguo, Wang, Xiyou, Geng, Daoshuang, Liang, ZhiYear:
2019
DOI:
10.1109/ICEPT47577.2019.245092
File:
PDF, 2.60 MB
2019