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Dynamic Observation of Electromigration in High Density Electroplated Nanotwinned Copper through in-Situ TEM
Shen, Fang-Chun, Huang, Chih-Yang, Wu, Wen-WeiVolume:
97
Journal:
ECS Transactions
DOI:
10.1149/09701.0145ecst
Date:
May, 2020
File:
PDF, 2.32 MB
2020