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[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Identification of essential factors causing solder bridging of right-angle solder interconnects in laser jet solder ball bonding process
Yue, Wu, Zhang, Jun-Xi, Gong, Cheng-Gong, Zhou, Min-Bo, Zhang, Xin-PingYear:
2019
DOI:
10.1109/ICEPT47577.2019.245822
File:
PDF, 2.71 MB
2019