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[IEEE 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy (2019.9.25-2019.9.27)] 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Quasi-3D Thermal Model of Stacked IC-TSV-BGA Package
Petrosyants, Konstantin O., Ryabov, Nikita I.Year:
2019
DOI:
10.1109/THERMINIC.2019.8923865
File:
PDF, 538 KB
2019