The effects on residual stress in multilayer NTC thermistors during soldering process and bending test (I. soldering process)
Yu, Nam Chol, Ri, Yong Ho, Kim, Chol ManJournal:
Microsystem Technologies
DOI:
10.1007/s00542-020-04855-0
Date:
May, 2020
File:
PDF, 1.22 MB
2020