Chemical vapor deposition of Cu films from copper(I)...

Thin Solid Films 2020 / 05 Vol. 701

Chemical vapor deposition of Cu films from copper(I) cyclopentadienyl triethylphophine: Precursor characteristics and interplay between growth parameters and films morphology

Prud'homme, Nathalie, Constantoudis, Vassilios, Turgambaeva, Asiya E., Krisyuk, Vladislav V., Samélor, Diane, Senocq, François, Vahlas, Constantin
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Volume:
701
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2020.137967
Date:
May, 2020
File:
PDF, 2.60 MB
2020
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