Wafer level bonding using localized radio-frequency...

Science China Technological Sciences 2010 / 05 Vol. 53; Iss. 5

Wafer level bonding using localized radio-frequency induction heating

MingXiang Chen, WenMing Liu, YanYan Xi, ChangYong Lin, Sheng Liu
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Volume:
53
Language:
english
Pages:
6
DOI:
10.1007/s11431-010-0006-7
Date:
May, 2010
File:
PDF, 1.54 MB
english, 2010
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