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Effect of Thermal Residual Stress on Age Hardening Behavior of SiC Whisker/Al-Cu Composites
Hong, Sung-Kil, Tezuka, Hiroyasu, Kamio, Akihiko, Choi, Jung-Chul, Hwang, Sun-HyoVolume:
60
Year:
1996
DOI:
10.2320/jinstmet1952.60.7_633
File:
PDF, 1.10 MB
1996