Thermosonic direct Cu pillar bonding for 3D die stacking

SN Applied Sciences 2020 / 6 Vol. 2; Iss. 6

Thermosonic direct Cu pillar bonding for 3D die stacking

Roshanghias, A., Rodrigues, A., Schwarz, S., Steiger-Thirsfeld, A.
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Volume:
2
Journal:
SN Applied Sciences
DOI:
10.1007/s42452-020-2887-9
Date:
June, 2020
File:
PDF, 2.01 MB
2020
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