[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Facile Preparation of Cu Micro-Nano Composite Particle Paste for Low Temperature Bonding
Mou, Yun, Peng, Yang, Li, Junjie, Liu, Jiaxin, Sun, Qinglei, Chen, MingxiangYear:
2019
DOI:
10.1109/icept47577.2019.245766
File:
PDF, 1.24 MB
2019