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Materials Today: Proceedings 2020 / 5

Facile approach to mitigate thermal issues in 3D IC integration using effective FIN orientation

Rakesh, Banothu, Mahindra, Kailaas, Sai Venkat Goud, Marri, Arun Vignesh, N., Padma, Tatiparti, Kumar Panigrahy, Asisa
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Journal:
Materials Today: Proceedings
DOI:
10.1016/j.matpr.2020.03.663
Date:
May, 2020
File:
PDF, 1.18 MB
2020
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